On May 27th project partners Infineon and Ericsson organized and contributed to the special session: “Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications”
In this session, experts from industry and academia will present the latest developments in high-frequency packaging and system integration at mmWave and sub-THz frequency bands. The session will begin with presentation of emerging wireless communication and radar sensing applications in these bands, and resulting challenges and opportunities for RF packaging. Advanced system integration platforms using different high-frequency materials for these applications will be presented. Emphasis will be laid on characterizing the packaging materials and interconnects at these very high frequencies as well as on co-design and co-simulation techniques. The session will conclude with presentation and discussion of concrete examples of latest developments of novel interconnects, components and wireless modules for 6G communication and radar applications at mmWave and sub-THz bands.
